New laser microcavity model
Crosslight is pround to announce a technical breakthrough in the device modeling of semiconductor optoelectronic devices: 2/3D simulation of microcavity laser diodes. The new modeling abandons the traditional approach of separating solutions of longitudinal and lateral modes and solves the Maxwell wave equations in all directions rigorously for all eigen modes operating at different wavelengths.
The microcavity option of PICS3D finds applications in VCSEL, RCLED, QD-LD/QD-LED, and microdisk lasers, where optical modes couple in different directions. A demonstration of the model as applied to surface relief VCSELs may be found in this presentation.
- Published in 2016 News, News & Events
New LDMOS Application Note
- Published in 2016 News
Collaboration with Dr. Gary Dolny
Crosslight Software is pleased to announce that we are entering into a partnership with Dr. Gary Dolny, who will act as an adviser on the development and applications of Crosslight’s state-of-the-art TCAD simulation tools with emphasis on power and analog devices.
Dr. Dolny holds a Ph.D. in Electrical Engineering from the University of Pittsburgh and has more than 35 years’ experience in the industry with companies including RCA Laboratories, Sarnoff Corporation (now SRI International), Harris Semiconductor, Intersil Corp and Fairchild Semiconductor, where he achieved the rank of Technical Fellow. He has published approximately 80 papers in peer-reviewed conferences and technical journals, received two conference best paper awards and has been awarded approximately 40 U.S. patents. He is a Senior Member of the IEEE, has served on the organizing committee of the International Devices Meeting (IEDM) and the International Symposium on Power Semiconductor Devices and ICs (ISPSD) and has served as Editor of both IEEE Transactions on Electron Devices and IEEE Electron Device Letters in the area of Solid State Power and High Voltage Devices.
For more details, please contact Crosslight or Dr. Dolny.
- Published in 2016 News, News & Events
Crosslight featured in Aug./Sep. 2015 edition of Compound Semiconductor magazine
As part of its 20-year anniversary coverage, Compound Semiconductor magazine has a featured article on Crosslight, which also celebrates its 20th anniversary this year.
- Published in 2015 News, News & Events
IC-CAP Export Capability added
Crosslight is proud to announce that the ability to generate .mdm files compatible with the popular IC-CAP parameter extraction program has been added to the 2015 version. This feature allows users to easily bridge the gap between device-scale modeling with Crosslight TCAD tools and large-scale IC modeling based on SPICE.
- Published in 2015 News, News & Events
New product SAWAVE released
We at Crosslight always seek to innovate and expand our product line so we are proud to announce the release of the world’s first commercial 3D TCAD simulator specialized in surface acoustic wave (SAW) device simulation. Our new simulation package SAWAVE aims to provide an accurate and efficient design tool for the SAW industry.
For a 2-month no-obligation free demo of SAWAVE, please fill out the application form in our Downloads section.
- Published in 2015 News, News & Events
July 2015 version finalized
Crosslight is proud to announce that our 2015 version is now undergoing final testing.
Model improvements:
- vectorial wave model improved for eigen mode solver (TM)
- metal model improved
- trap AC model improved
- tunneling model improved to better treat wider gap materials
- additional continuous trap types
- improvement of q_transport model to better simulate InGaN LED droop
- periodic boundary conditions in Schrödinger and k.p solvers
- gain calculations of type II superlattices with non-common atom interface effects
- numerous bug mixes
New features:
- trap assisted tunneling model for both inter- and intra-band
- power-dependent LD facet model implemented
- multiple scans of mixmode DC sources
- simultaneous mixmode simulation of multiple TCAD devices
- mixmode AC model
- continuous trap models for interfaces (2D)
- magnetic flux density /inductance computation capability
- arbitrarily-oriented MQW (e.g. V-shaped pits)
- ability to model a compact model from LASTIP and interface with Lumerical simulators
- trap related surface capacitance and leakage model
- new stretch-vertical-line feature for the LAYER program to create complicated, nearly paralleled layer structures
- many convenient features added for GUI and as well as for core simulator
Interested demo users and customers with valid maintenance contracts may contact Crosslight for early access to this version.
- Published in 2015 News, News & Events
Software Tutorial at Photonics West 2015
Crosslight would like to invite all participants of the upcoming Photonics West conference in San Francisco to attend a free seminar and software tutorial on optoelectronic device simulation. The tutorial gives a hands-on introduction to our high-end simulation tools for electronic and optoelectronic devices: APSYS, LASTIP and PICS3D. These software packages combine electrical, thermal, optical, and quantum-mechanical models in two or three dimensions and can be applied to a large variety of semiconductor devices such as laser diodes, LEDs, solar cells and transistors.
The tutorial will explain and demonstrate the basic operation of these software tools. Strategies for setting the right model options and material parameters to obtain realistic simulation results will also be discussed. Using realistic device examples, deep insight into micro- and nano-scale physical processes will be provided .
The seminar will be held on Thu. Feb. 12th 1PM – 5PM in the Sierra A room of the Marriott Marquis hotel. More information on the tutorial can be obtained at the conference’s Industry Events page.
While the seminar is free, preregistration from interested participants would be appreciated. Attendees who wish to participate in the hands-on part of the tutorial are also advised to bring along their Windows-based laptop and visit the Crosslight booth (#4517) in the North Exhibit Hall prior to the seminar for help in setting up the software.
- Published in 2015 News, News & Events
New GaN HEMT tutorial movie
We are pleased to announce that a new tutorial movie for GaN HEMT has been uploaded. GaN HEMT is widely believed to be the next generation of power devices and this technology is expected to drive a market worth billions of dollars in annual revenue in the near future. As a world leader in compound semiconductor device modeling, Crosslight intends to build on its two decades of experience and will focus its efforts on the development of best-in-class device and process simulation tools for GaN power HEMT devices.
- Published in 2014 News, News & Events
Aug. 2014 version finalized
We are proud to announce the release of Version Aug14 of device simulator packages (APSYS, LASTIP, PICS3D and OPTOWIZARD).
The main feature in this version is a complete upgrade of Crosslight’s famous compound semiconductor material data library system. The new material data system, named simplified complex library (SCXLIB), unifies passive and active semiconductor material macros of different types (quantum wells of different types, quantum wire, quantum dot and active-bulk region) and offers clear and easy-to-understand material names.
For new users of Crosslight, the SCXLIB material system is clearer and easier to set up. For expert users, the new data system offers better consistency and robustness in applications dealing with complicated quantum well/wire/dot structures.
While encouraging the conversion of all existing projects into the new SCXLIB system with a semi-automatic converter, Version Aug14 maintains full backward compatibility. We intend to support older material system for several years before a complete switch over.
Other significant features include the upgrade of non-local quantum transport model for multiple quantum well (MQW). The Aug14 version introduces
a model to account for leakage due to hot carriers generated by CCCH Auger recombination, an effect which was recently claimed to be observed experimentally.
The new hot-Auger model works together with other existing models such as electron overflow leakage and hole injection blocking in GaN-LED. We are proud to offer APSYS Aug14
that would satisfy all schools of thoughts in the continued controversy over the origin of LED droop.
The mixed-mode model has been upgraded to handle multiple TCAD devices in a circuit environment. Users can set up process and device simulations for individual devices with isolated mesh (2D or 3D); our Minispice model (Crosslight’s implementation of SPICE) can then be used to join the individual devices in a circuit simulation.
For sensor applications, k.p perturbations due to non-common-atom interfaces (such as those in type II InAs/GaSb superlattices) have been implemented as a first step to improving our model.
Full implementation of the model (including periodic QW boundary conditions and gain calculations) will also be made available in our beta version soon; please contact Crosslight for early access.
Other improvements involve enhancement of mobility model collection, enhanced FDTD capability in the OPTOWIZARD package, and improvement in the advanced NEGF transport model. Interested readers
may contact Crosslight for more details.
- Published in 2014 News