Crosslight Software is pleased to announce that we are entering into a partnership with Dr. Gary Dolny, who will act as an adviser on the development and applications of Crosslight’s state-of-the-art TCAD simulation tools with emphasis on power and analog devices. Dr. Dolny holds a Ph.D. in Electrical Engineering from the University of Pittsburgh and

As part of its 20-year anniversary coverage, Compound Semiconductor magazine has a featured article on Crosslight, which also celebrates its 20th anniversary this year.

IC-CAP Export Capability added

Tuesday, 01 September 2015 by

Crosslight is proud to announce that the ability to generate .mdm files compatible with the popular IC-CAP parameter extraction program has been added to the 2015 version. This feature allows users to easily bridge the gap between device-scale modeling with Crosslight TCAD tools and large-scale IC modeling based on SPICE.

New product SAWAVE released

Monday, 10 August 2015 by

We at Crosslight always seek to innovate and expand our product line so we are proud to announce the release of the world’s first commercial 3D TCAD simulator specialized in surface acoustic wave (SAW) device simulation. Our new simulation package SAWAVE aims to provide an accurate and efficient design tool for the SAW industry. For

July 2015 version finalized

Wednesday, 08 July 2015 by

Crosslight is proud to announce that our 2015 version is now undergoing final testing. Model improvements: vectorial wave model improved for eigen mode solver (TM) metal model improved trap AC model improved tunneling model improved to better treat wider gap materials additional continuous trap types improvement of q_transport model to better simulate InGaN LED droop

Crosslight would like to invite all participants of the upcoming Photonics West conference in San Francisco to attend a free seminar and software tutorial on optoelectronic device simulation. The tutorial gives a hands-on introduction to our high-end simulation tools for electronic and optoelectronic devices: APSYS, LASTIP and PICS3D. These software packages combine electrical, thermal, optical,

New GaN HEMT tutorial movie

Tuesday, 30 September 2014 by

We are pleased to announce that a new tutorial movie for GaN HEMT has been uploaded. GaN HEMT is widely believed to be the next generation of power devices and this technology is expected to drive a market worth billions of dollars in annual revenue in the near future. As a world leader in compound

Aug. 2014 version finalized

Thursday, 28 August 2014 by

We are proud to announce the release of Version Aug14 of device simulator packages (APSYS, LASTIP, PICS3D and OPTOWIZARD). The main feature in this version is a complete upgrade of Crosslight’s famous compound semiconductor material data library system. The new material data system, named simplified complex library (SCXLIB), unifies passive and active semiconductor material macros

A research article co-authored by Crosslight’s Simon Li has been selected has an Applied Physics Letters Editor’s pick in Device Physics. As a result of this selection, the article may be downloaded for free for a limited time from the APL website.

Are Electron-Blocking Layers Always Beneficial? An APL article co-authored by Crosslight’s Simon Li and Changsheng Xia is featured in Compound Semiconductor magazine. The full text can be found here.

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